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SK Hynix

SK Hynix

Semiconductor manufacturer

Appears in 10 stories

Stories

SK Hynix halts Solidigm US IPO after shareholder concerns

Money Moves

Parent company of Solidigm; halted IPO review

SK Hynix halted a planned US listing of its Solidigm memory-chip unit on October 23, shelving a deal that could have raised $15 billion at a $150 billion valuation. The company cited market volatility, but South Korean regulators had also questioned whether the listing would hurt existing shareholders.

Updated 2 hours ago

South Korea directs $880 billion private buildout into chips and AI data centers

Money Moves

Approved $38 billion for two new fabs while upgrading its China plant and drawing Samsung's engineers with bigger bonuses

South Korea's chip buildout is starting to produce contracts. On August 10 the government said it would launch a 5 trillion won ($3.5 billion) fund for chip materials, parts, equipment and fabless firms, add 5 trillion won of trade finance, and pass a special act this year to speed the new manufacturing hubs. On September 29, Korea Land and Housing Corporation awarded a Daewoo E&C-led consortium the $639 million first-phase works at the Yongin complex, where Samsung's first fab there is planned.

Updated 12 hours ago

South Korean corporate surplus funds hit record high on chip boom

Money Moves

Record Q2 profits driving the rise in corporate surplus funds

South Korean companies held 67.1 trillion won in surplus financial assets at the end of June, more than triple the record they set three months earlier, fueled by memory chip profits at Samsung Electronics and SK hynix. The boom has carried into the third quarter: the current account surplus hit $46.11 billion in August, near its all-time record, and September exports surged to a record $120.94 billion as chip prices rose more than 100%.

Updated Oct 9

Samsung stacks memory directly on AI accelerators with zHBM prototype

New Capabilities

Current HBM market leader, Samsung's main rival

Samsung has shown a working prototype of zHBM, a memory architecture that stacks high-bandwidth memory directly on top of AI accelerators. The design removes the interposer, the silicon bridge that currently carries data between logic and memory chips placed side by side.

Updated Sep 10

First open standard published for high bandwidth flash AI memory

New Capabilities

Co-author of the HBF standard

AI chips are starving for memory. On August 4, 2026, SK hynix and Sandisk published the first open technical standard for a possible fix: High Bandwidth Flash, or HBF.

Updated Aug 4

Global chip selloff wipes out over $1 trillion as custom AI silicon challenges Nvidia

Money Moves

Hardest-hit stock in the July 28 selloff

Chip stocks lost more than $1 trillion in market value on July 28, 2026. Memory maker SK Hynix fell about 14% and Samsung dropped over 10%, pulling South Korea's Kospi down roughly 9%. Nvidia slid more than 5% and briefly handed the title of world's most valuable company back to Apple.

Updated Jul 28

SK Hynix debuts on Nasdaq in largest US listing by a foreign company

Money Moves

Newly listed on Nasdaq

SK Hynix rang the Nasdaq opening bell on July 10 and raised about $26.5 billion. No foreign company has ever raised more in a US share sale.

Updated Jul 10

SK hynix ships first 12-layer HBM4E samples for AI systems

New Capabilities

Market leader; first to ship HBM4, racing on HBM4E

Modern AI chips can crunch numbers faster than memory can feed them data. On June 18, 2026, SK hynix said it shipped samples of HBM4E, a stacked memory chip built to narrow that gap, to major customers.

Updated Jun 18

AI memory chip boom reshapes South Korea's stock market

Money Moves

World's largest high-bandwidth memory producer; all 2026 HBM capacity sold out

South Korea's benchmark KOSPI stock index crossed 6,000 points for the first time on February 25, 2026. It completed its climb from 5,000 to 6,000 in just 34 trading days, the fastest thousand-point advance in the index's history.

Updated May 29

The packaging pivot: why AI's real bottleneck isn't chips—it's putting them together

Built World

Market leader in HBM with 61% global share

For decades, chip packaging was the unglamorous final step—stacking and connecting silicon dies after the real engineering was done. Now it's the constraint holding back AI.

Updated May 20