Kung Ming-hsin

Rule Changes

Signed Pax Silica framework for Taiwan

For the first time since COCOM dissolved in 1994, the United States is assembling a formal technology bloc. Taiwan signed the Pax Silica Declaration on January 27, 2026—making the world's dominant chip manufacturer a formal participant alongside Israel, Japan, South Korea, Singapore, Netherlands, UK, Australia, Qatar, and the UAE. The signing occurred during the U.S.-Taiwan Economic Prosperity Partnership Dialogue, with Under Secretary Jacob Helberg and Taiwan's Minister of Economic Affairs Kung Ming-hsin witnessing AIT and TECRO endorse principles of 'mutual prosperity, technological progress, and supply chain resilience.' Two days later, Helberg confirmed India will join in February 2026, which would bring the world's two largest democracies and 90% of advanced chip production into a single coalition.

Updated Jan 30