Sangwook Han

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Samsung stacks memory directly on AI accelerators with zHBM prototype

As of September 2026: Presented three-phase HBM roadmap at Hot Chips 2026

Samsung has shown a working prototype of zHBM, a memory architecture that stacks high-bandwidth memory directly on top of AI accelerators. The design removes the interposer, the silicon bridge that currently carries data between logic and memory chips placed side by side.

Updated Sep 10