DRAM design team member, Samsung Electronics
Appears in 1 story
Presented three-phase HBM roadmap at Hot Chips 2026
Samsung has shown a working prototype of zHBM, a memory architecture that stacks high-bandwidth memory directly on top of AI accelerators. The design removes the interposer, the silicon bridge that currently carries data between logic and memory chips placed side by side.
Updated 2 hours ago
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