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Third-place HBM competitor with aggressive expansion plans
For decades, chip packaging was the unglamorous final step—stacking and connecting silicon dies after the real engineering was done. Now it's the constraint holding back AI. SK Hynix announced a $12.9 billion investment to build the world's largest advanced packaging facility in South Korea, a bet that the company controlling 61% of the high-bandwidth memory market can't afford to lose its lead as competitors circle. At CES 2026, the company unveiled the first 16-layer, 48GB HBM4 module—double the capacity of current generation memory—requiring silicon wafers thinned to just 30 micrometers, thinner than a human hair.
Updated Jan 15
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