Jacob Helberg

U.S. Under Secretary of State for Economic Affairs - Leading Pax Silica implementation

For the first time since COCOM dissolved in 1994, the United States is assembling a formal technology bloc. Taiwan signed the Pax Silica Declaration on January 27, 2026—making the world's dominant chip manufacturer a formal participant alongside Israel, Japan, South Korea, Singapore, Netherlands, UK, Australia, Qatar, and the UAE. The signing occurred during the U.S.-Taiwan Economic Prosperity Partnership Dialogue, with Under Secretary Jacob Helberg and Taiwan's Minister of Economic Affairs Kung Ming-hsin witnessing AIT and TECRO endorse principles of 'mutual prosperity, technological progress, and supply chain resilience.' Two days later, Helberg confirmed India will join in February 2026, which would bring the world's two largest democracies and 90% of advanced chip production into a single coalition.

Updated Jan 30

U.S. Under Secretary of State for Economic Affairs (lead architect of Pax Silica rollout) - Leading coalition-building with allies; directing posts to identify projects and choke points

The U.S. just tried to name a new era into existence: “Pax Silica.” On December 12, 2025, Washington launched a coalition with key tech allies to lock down the ingredients of AI power—minerals, silicon, energy inputs, and the factories that turn them into chips and data centers.

Updated Dec 12, 2025