Chief Executive Officer, SK hynix
Appears in 5 stories
Co-leading the HBF standard and targeting the next-generation NAND market
AI chips are starving for memory. On August 4, 2026, SK hynix and Sandisk published the first open technical standard for a possible fix: High Bandwidth Flash, or HBF.
Updated Aug 4
Led the company's US listing
SK Hynix rang the Nasdaq opening bell on July 10 and raised about $26.5 billion. No foreign company has ever raised more in a US share sale.
Updated Jul 10
Leading SK hynix through the HBM4 ramp and HBM4E qualification
Modern AI chips can crunch numbers faster than memory can feed them data. On June 18, 2026, SK hynix said it shipped samples of HBM4E, a stacked memory chip built to narrow that gap, to major customers.
Updated Jun 18
Leading company through record-breaking performance
South Korea's benchmark KOSPI stock index crossed 6,000 points for the first time on February 25, 2026. It completed its climb from 5,000 to 6,000 in just 34 trading days, the fastest thousand-point advance in the index's history.
Updated May 29
Leading company through HBM expansion
For decades, chip packaging was the unglamorous final step—stacking and connecting silicon dies after the real engineering was done. Now it's the constraint holding back AI.
Updated May 20
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