Semiconductor and electronics maker
Appears in 8 stories
Building two of four new memory fabs
On June 29, 2026, South Korea directed Samsung and SK Hynix to build four new memory fabs in the southwest as part of an 880-billion-dollar, ten-year private buildout. Three days later, both companies had narrowed their Gwangju site candidates to two locations and pledged a combined 240 trillion won for the Chungcheong region, adding a second investment zone south of Seoul.
Updated Jul 2
Chief rival; shipped HBM4E samples three weeks earlier
Modern AI chips can crunch numbers faster than memory can feed them data. On June 18, 2026, SK hynix said it shipped samples of HBM4E, a stacked memory chip built to narrow that gap, to major customers.
Updated Jun 18
Largest KOSPI-listed company by market cap; ramping HBM4 production to close gap with SK Hynix
South Korea's benchmark KOSPI stock index crossed 6,000 points for the first time on February 25, 2026. It completed its climb from 5,000 to 6,000 in just 34 trading days, the fastest thousand-point advance in the index's history.
Updated May 29
Launched Galaxy S26 series, pursuing 800 million AI device target
Two years ago, Samsung declared its Galaxy S24 the 'world's first AI phone.' On February 25, Samsung unveiled the Galaxy S26 with three competing AI assistants running simultaneously, a privacy display that physically blocks shoulder surfers at the pixel level, and a 100-trillion-operation processor. The company is rebuilding phones around AI as the core organizing principle.
First to put live systolic and diastolic readings on a smartwatch
Oura's fifth-generation smart ring went on sale Thursday with blood pressure monitoring and on-demand telehealth access, starting at $399. The Ring 5 is 40% smaller than its predecessor and monitors nighttime blood pressure shifts that can warn of cardiovascular strain.
Committed to fixed profit-sharing for the first time
Samsung Electronics has run for 57 years without ever tying a fixed share of profits to worker pay. That changed Wednesday.
Updated May 27
Second-place HBM competitor, planning 50% capacity increase
For decades, chip packaging was the unglamorous final step—stacking and connecting silicon dies after the real engineering was done. Now it's the constraint holding back AI.
Updated May 20
Leading AI home appliance integration with Google partnership
Samsung just put Google's Gemini AI inside a refrigerator. Not alongside it, not as an app—built directly into the hardware.
Updated May 19
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